Review the instruction manual for the model sputter guns you have with your system. You then can sputter this sample till you see the underlying layer. If you want to do sputter depth profiling and need to turn the sputter times into depts in nm you need to prepare a sample that has a known thickness of the material that you will sputter mounted on a substrate of another material. Sputter guns are located on the lower side in the chamber. Model drs100 digital raster scan is a user programmable controller used for xy deflection plates in electron and ion guns.
Proper use of your unit, according to the operation manual, should. The development of high resolution feg sems has brought about more wide spread use of specialised techniques. Lesker torus sputter gun will have a corresponding ntype connector with the center pin connected directly to the cathode and the outer conductor connected to the invacuum anode which is typically tied to the rest of the vacuum system and, therefore, grounded. Tbsputter sputter coating technical brief 10 issue 1 6 choice of sputtering material. This dry processing technique is capable of not only removing the requirement of. Open target shutters sp1, sp2 or sp3 from 5, 6 or 7 and mount the sputter targets accordingly as described in the brief manual. In recent years, magnetron sputtering has been widely utilized as a gasphase technique for fabrication of metalgraphene hybrids. If more sputter time is needed then stop your process and keep system idle chamber under high vacuum for 1.
Check the resistance between target and ground floor sheet. Magnetron sputtering source data sheet specifications. As stated many times, metal coating is an indispensable technique for sem. Includes scanned manuals, flyers, walkthroughs, and advertising. The minimum rf or dc power ramping is 100 wattsmin. The basic components of a sputter chamber, consisting of a powder sample holder, a turbo molecular pump, and an orthogonally oriented sputter gun, are illustrated in fig.
A collection of manuals and instructions related to firearms, handheld weapons, and other related products. The thin film preparation is performed using a dc magnetron sputter gun. The rbd 3 kv large area sputter ion source is a high beam current, variable energy. The maximum rf power to any rf gun is 150 wattsduring process. If sputtering in manual mode,the plasma parameters rf forward and reflected power, gas flows, sputter pressure, etc. Must be mounted to the rotator spindle to prevent coating the heating lamp window. Metal atoms ejected from the target by the ionized gas cross the plasma to deposit onto the any surface within the coating unit including the specimen. This low cost planar magnetron sputtering source is compact, easy to install and requires no target bonding. Refer to gun manual for technical specifications, water requirements, and target replacement instructions and gun maintenance. Quick couple feedthrough adapter for adjusting the mak2 gun height. The gas discharge is operated at constant power and biased in the range 300400 v.
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